967 Semi-Automatic Wafer Mounter

967 Semi-Automatic Wafer Mounter Key Features

  • Automatic mounting process with hands free operation
  • Minimal footprint – Tabletop design
  • Operator friendly; quick and simple to use and maintain
  • Minimal tape usage
  • Fast, accurate, bubble free wafer mounting
  • Mounts up to 120 wafers per hour
  • Adjustable roller pressure
  • Compatible to all dicing tapes and frames (Up to 200 or 300mm)

The 967 Semiautomatic Wafer Mounter from ADT is a small footprint user friendly system for automatic bubble free mounting up to 200mm (967) or 300mm (967L) wafers, onto either standard blue or UV tapes.

The 967 provides fast, accurate mounting, avoiding the risks associated with manual systems. Once set, the same sequence is used for each wafer, thus ensuring high quality and consistent results. Process parameters, such as Roller pressure, Chuck temperature and Mounting speed, can easily be set using the user-friendly interface.

The 967 Wafer Mounter is also designed to minimise or reduce mounting costs, using all standard dicing tapes (pre-cut tape is not required), lowering the tape usage by as much as 25% compared to manual mounting. The low air and power consumption makes the 967 very economic.

ADT 967 Semi-Automatic Wafer Mounter Specifications

Supported tapes:

Dicing blue tapes / UV tapes

Supported frames:

DTF 2-8-1; DTF 2-6-1; 350-103; 350-104

Supported wafers:

Up to 200mm or 300mm diameter

Mounting time:

< 30 seconds

Dimensions (WxDxH):

967: 655 x 590 x 560 mm, 976L: 791 x 706 x 557 mm

Temp Controlled Chuck heater:

Up to 65 °C

Vacuum Holder:

Internal vacuum generator to hold workpieces

Backing tape collector:

Backing tape collecting mechanism for UV tape

Roller Pressure:

1-6 bar

Optional Custom chucks:

Non Contact, rectangular frame & custom chucks


Electro-static eliminator option

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Further Information

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Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices

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Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing

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Available from Inseto in the United Kingdom, Ireland & Scandinavia

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