Laser Trimming Equipment by L-TRIS
L-TRIS is the outcome of the merger of LS Laser Systems and EPP Electronic Production Partners on 16 December 2020. L-TRIS is a leading manufacturer of laser trimming equipment used to trim thick circuits, thin film circuits and wafer level substrates. Based in Munich, Germany, L-TRIS are part of the Photonics Systems Group, specialists in laser related technologies.
With over 25 years of experience in trimming and micro materials processing, their laser systems are used to trim resistive, capacitive and inductive materials, when a signal needs to be tuned in circuit to a specific value.
Typical applications include resistor networks, proximity switches, oscillators, pressure and flow sensors used in Automotive, Bio medical, Aerospace, Defence, Telecoms and many consumer electronics industries, using both thick and thin film technologies.
The systems can be either stand alone or integrated into a production line
See our “Knowledge Base Document” for a guide to the basics of Laser Trimming thick-film and thin-film circuits.
LT2200/2100 Thick/Thin Film Trimming Equipment
Manual or automated systems for passive or active laser trimming of thin film and thick film circuits.
L-TRIS 350 Wafer Laser Trim Equipment
Fully integrated state-of-the-art laser trimmer and wafer prober system for active trimming.
Tel: +44 (0)1264 334505
Acitve and passive trimming of thick film and thin film circuits and semiconductor wafers or printed substrates.
Microelectronics, Hyrbid Circuit Production, Resistor Network Fabrication, RF and Microwave Circuits, Inductive Devices, Capacitive Devices, other hybrid and SMT related circuits.
United Kingdom, Ireland and Nordic Region