Inseto

Wafer Trimming Equipment

Key Features

  • State-of-the-art Wafer Laser Trimming equipment
  • Fully integrated Laser Trim and Wafer Prober system
  • Seamless integration with ATE with real-time tester interface
  • Superior laser control ensures process consistency & highest yields
  • Advanced vision and motion for positioning and alignment
  • Easy to programme and opertate WaferTrim™ software

The WaferTrim™ M350 laser trim system is the next generation solution for active IC trim (trimming while probing and measuring).

In addition to active trim, the system’s versatility provides link cutting, passive trim, and linear trim capabilities, allowing you to best address your process needs.

System Specifications:

  • Closed Loop X, Y, Z, Theta stage
  • X-Y Accuracy: +/-2.0 microns
  • Z Range: 10mm (0.39h)
  • Z Accuracy: +/-0.5 micron
  • Chuck Size: Supports 100-200mm wafers
  • Chuck Material: Choice of Al, Ni or Au finish
  • Probe Card Size: 4.5 to 9inch standard
  • Beam Positioner: Type: Galvanometer-based, stationary optics
  • Positioning Accuracy: < 1 micron (3 sigma)
  • Minimum Spot Size: 6.5-12micron, 5 Micron optional
  • Viewing: Dual CCD camera operation-separate hi-mag viewing integrated vision processing sub-system simplifies setup and improves reliability and throughput of automatic wafer alignment
  • Laser Type: Diode-pumped YLF or YAG
  • Wafer Trim Equipment

Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Acitve laser trimming of semiconductor circuits.

Industry Segments

Semiconductor Wafer Fabrication, Flexible Electronics, Plastic Electronics, Microelectronics, Hyrbid Circuit Production, Resistor Network Fabrication, RF and Microwave Circuits, Inductive Devices, Capacitive Devices, other hybrid and SMT related circuits.

L-TRIS Website

www.l-tris.com

Region

United Kingdom, Ireland and Nordic Region

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