Lithography, Wafer Bonding & Mask Clean-Fabrication Equipment by SÜSS MicroTec
SÜSS MicroTec are the manufacturer of the world’s first mask aligner and recognised technology leader, designer and producer of process equipment for backend lithography, wafer bonding and photomask processing.
SÜSS MicroTec provides cost-effective solutions with unsurpassed quality and cutting-edge technology, enabling their customers to maximise yield at high throughput thus reducing cost of ownership.
In close cooperation with research institutes and industry partners SÜSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SÜSS MicroTec supports more than 8,000 installed systems worldwide.
High-resolution lithography exposure systems providing exceptional reliability & maximum light uniformity.
Spin Coaters, Spray Coater & Developer
SUSS spin coaters, developers and spray coaters are renowned for their consistency including bench-top, free-standing to automated tools.
Wafer Bonders, De-Bonders & Aligners
Manual to automated permanent and non-permanent wafer bonders & de-bonders, for MEMS, SOI and advanced packaging applications.
Manual to fully automated mask or wafer cleaning systems and mask fabrication equipment for developing, cleaning, baking, etching etc.
Remanufactured Equipment – SÜSS ReMan
Certified SÜSS MicoTec original equipment fully refurbished & updated to the latest safety regulations and standards.
Tel: +44 (0)1264 334505
Wafer and Substrate Lithogrpahy, Wafer Coating and Cleaning Processes of MicroFluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN, Photonic Components etc.
Semiconductor Wafer Fabrication, University Research and Development
SÜSS MicroTec Website
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland