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Mask Aligner by SÜSS MicroTec

SÜSS MicroTec are leaders in the development and production of high-quality Mask Aligner and Wafer Bond Aligner’s used by research, development and production facilities worldwide.

Equipped with reliable, precision alignment and high resolution printing capabilities into the submicron range, SÜSS aligners are renowned for their small footprint, ease of use, quality of results and long term reliability.

Featuring patented exposure optics with LED or mercury lamp houses, optimal results are achieved in either proximity or contact lithography modes for wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices and other semiconductor related device R&D applications etc.

See our “Knowledge Base Document” for a guide to the basics of UV photo-lithography.

SÜSS Microtec

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

UV Lithography, Wafer Bond Alignment, Wafer Bonding

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website

www.suss.com

Region

United Kingdom and Ireland

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