Mask Aligner by SÜSS MicroTec
SÜSS MicroTec are leaders in the development and production of high-quality Mask Aligner’s, Imprint Lithography Tools and Wafer Bond Aligner’s used by research, development and production facilities worldwide.
Equipped with reliable, precision alignment and high resolution printing capabilities into the submicron range, SÜSS aligners are renowned for their small footprint, ease of use, quality of results and long term reliability.
Featuring patented exposure optics with LED or mercury lamp houses, optimal results are achieved in either proximity or contact lithography modes for wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices and other semiconductor related device R&D applications etc.
See our “Knowledge Base Document” for a guide to the basics of UV photo-lithography.
MJB4 Mask Aligner
The easy to use MJB4 processes Pieces, Small Substrates and Wafers up to 100mm, for low volume production & R&D applications.
More
MA/BA Gen4 Series Mask Aligner
The compact, easy to use MA/BA Gen4 is a manually loaded system for standard exposure of Pieces, Substrates and Wafers up to 200mm.
More
MA8 Gen5 Imprint Aligner
The semiautomatic manully loaded system that sets the benchmark for semiconductor imprint lithography applications.
More
MA12 Operator Assisted Aligner
The MA12 is a 300mm, operator-assisted Mask Aligner for industrial research and production applications.
More
MA100/150e Gen2 Automatic Aligner
The MA100/150e Gen2 is a fully automatic, high throughput system for substrates and wafers up to 150mm.
More
MA200 Gen3 Automatic Mask Aligner
The MA200 GEN3 is a fully automatic 200mm exposure tool with intelligent solutions for high volume applications.
More
Imprint Lithography
Nano and micro imprint lithography technology from semi-automatic processing through to dedicated fully-automatic imprint cluster solutions.
More
SÜSS MicroTec
See the full SÜSS MicroTec product range
More
Further Information
Applications
UV Lithography, Wafer Bond Alignment, Wafer Bonding
Industry Segments
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
Region
United Kingdom and Ireland
Request Form
Back to top