MA/BA Gen4 Pro Mask Aligner
MA/BA Gen4 Pro Key Features
- R&D through Small Scale Production Mask Aligner
- Wide Range of Processes within one Tool
- Manually Assisted, Auto & Direct Alignment
- Expose Wafers up to 200mm & Substrates up to 200 x 200mm
- Process 5x5mm Pieces Upwards and Partial Wafers
- Patented Diffraction Reducing Optics
- Bond Align, Fusion Bond, Imprint & Plasma Activation Options
The compact, easy to use MA/BA Gen4 Pro is a manually loaded system that sets the benchmark in semiconductor submicron Research and Microsystems Production.
The system can be configured for up to 150mm substrates (MABA6 Gen 4 PRO) or up to 200mm substrates (MABA8 Gen4 PRO).
Top Side, Bottom Side and Infrared alignment capabilities coupled with SUSS Microtec’s proven Pattern Recognition systems, provides Assisted and Automatic alignment to the high degree of accuracy (0.5um, TSA) customers demand. SUSS Microtec have now enhanced this functionality with the new Direct-Align protocol which can reliably, repeatedly produce alignment accuracies to within 0.25um.
The MA/BA Gen4 Pro offers maximum flexibility thanks to wide range of tools and options, which ensure the platform is ready to develop leading edge technologies. Advanced packaging, 3D integration, MEMS and Compound Semiconductor applications can all be achieved using this versatile unit.
Several imprint processes for micro and nanoimprint are supports such as SCIL, SMILE and UV-NIL. With minor adjustment wafer to wafer alignment, fusion bonding and Plasma activation of substrate surfaces are also possible.
Coat Develop Equipment
Wafer Solder Bumping
Laser Trimming Equipment
Knowledge Base Articles
What Is A Mask Aligner (IKB-068)
Photolithography Basics (IKB-038)
Imprint Photolithography (IKB-054)
Photolithography Exposure Modes (IKB-053)
Semiconductor Wafer Selection Guide (IKB-046)
Semiconductor Wafer Description Nomenclature (IKB-044)
Tel: +44 (0)1264 334505
UV Lithography, Wafer Bond Alignment, Wafer Bonding
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
United Kingdom and Ireland