MA12 Operator Assisted Mask Aligner

MA12 Key Features

  • Cost efficient 300 mm exposure tool
  • High intensity exposure optics
  • Contact Modes: Proximity, Soft, Hard, Vacuum
  • Uniformity < 3.5% (300mm)
  • LED or mercury lamp-house options
  • Alignment Method: TSA, BSA, IR
  • Diffraction Reducing Exposure Optics (HR & LGO)
  • Small footprint and enhanced ergonomics

The MA12 Gen3 from SUSS MicroTec is a high precision manual tool for processing 300mm wafers or up to 300x300mm substrates.  

Based on SUSS MicroTec’s latest mask aligner technology the system provides a wealth of alignment capabilities with superior optical performance and high overlay accuracy required for 300mm wafers and substrates.  The MA12 mask aligner has been designed with the production of MEMS devices on large substrates and advanced packaging applications in mind.

The MA12 is a high precision tool suited device development and production environments; the operator-assisted system maintains a high degree of process control and reliability in combination with the advantages of manual wafer handling.

Using the imprint technology SMILE from SUSS MicroTec the MA12 Gen3 enables a large range of imprint and full field lithography applications for the LED, micro-optics, augmented reality, MEMS & NEMS as well as 3D integration and compound semiconductor markets.

MA12 Operator Assisted Mask Aligner Technical Downloads


MA12 Mask Aligner Brochure


Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505



UV Lithography, Wafer Bond Alignment, Wafer Bonding

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website


United Kingdom and Ireland

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