MA12 Operator Assisted Mask Aligner
MA12 Key Features
- Cost efficient 300 mm exposure tool
- High intensity exposure optics
- Contact Modes: Proximity, Soft, Hard, Vacuum
- Uniformity < 3.5% (300mm)
- Alignment Method: TSA, BSA, IR
- Diffraction Reducing Exposure Optics (HR & LGO)
The MA12 from SUSS Microtec is a high precision manual tool for processing 300mm wafers or up to 300x300mm substrates.
Based on SUSS Microtec’s latest mask aligner technology the system provides a wealth of alignment capabilities with superior optical performance and high overlay accuracy required for 300mm wafers and substrates.
SUSS Microtec’s MA12 is a high precision tool suited device development and production environments; the operator-assisted system maintains a high degree of process control and reliability in combination with the advantages of manual wafer handling.
Tel: +44 (0)1264 334505
UV Lithography, Wafer Bond Alignment, Wafer Bonding
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
United Kingdom and Ireland