MJB4 Mask Aligner

MJB4 Key Features

  • Compact UV mask aligner
  • Process pieces (5x5mm) to wafers up to 100mm
  • Ideal for laboratory, R&D and small scale production
  • Soft, hard, vacuum & soft-vacuum contact modes
  • Exceptional uniformity, repeatability & reliability
  • High-resolution printing
  • LED lamp-house

The compact design of the SUSS MicroTec MJB4 Mask Aligner provides the perfect solution for laboratories, research environments and pilot production, with high resolution printing.

Developed to provide leading levels of exposure for small substrates, pieces and wafers up to 100mm, the MJB4 provides an economical answer where high precision and resolution are required, on a reliable, stable and robust platform. Applications include developing novel sensing platforms & battery technologies and in the fabrication of next generation communication devices such as 5G and photonic systems.

The system is designed for the processing of fragile, warped or part wafers and pieces from a few millimetres up to 100mm diameter. Precision alignment is achieved with a split field microscope, whilst a Wedge Error Compensation (WEC) provides optimal parallelism between the substrate and mask. 

The patented diffraction reducing optics feature fast switching between different wavelengths. An LED Lamp-house with light uniformity <2.5%, is switchable for Broadband or G, H & I lines as required.

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Tel: +44 (0)1264 334505



UV Lithography, Exposure and Printing of Semiconductor Wafers and other Substrates

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website


United Kingdom and Ireland

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