HMxSquare Photo-mask Cleaner
HMxSquare Key Features
- Semiautomatic Photo Mask cleaning system
- Manual load with automatic sequential processing
- SEMI Certified and qualified for >1μm technology nodes
- High up-time and low Cost of Ownership
- Mask / substrate clean, develop, etch & strip
- For pieces up to either 9” or 14” Masks & 3-14” square substrates
- Advanced safety features
- Small footprint and lost cost of ownership
The HMxSquare photo mask cleaner from SUSS MicroTec, is available in two models:
HMx9 – For cleaning up to 9” Masks, 50–200 mm diameter wafers, 3–9 inch square substrates and pieces
HMx14 – For cleaning up to 14” Chrome and chrome oxide photomask, 100-300mm wafers and 5–14 square substrates (other on request).
With a minimal cleanroom footprint, the systems are SEMI S2, S8, S13 compliant and designed for high-quality mask or substrate cleaning and the mask fabrication develop, clean and etch processes in the 3 µm – 250 nm technology nodes.
The HMxSquare is manually loaded with automatic sequential processing. With worldwide reference sites the systems combine stability and reliability to provide optimum results and a low cost of ownership.
The equipment is designed to comply with the latest environmental and safety regulations and is available with full-jet spray nozzle dispense with pre-heated media, front-side and back-side rinse, integrated acid-chemical storage, automatic chemical refill, brush, megasonic or binary spray and interchangeable chucks etc.
Tel: +44 (0)1264 334505
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
United Kingdom and Ireland