Wafer Bonder by SÜSS MicroTec
SUSS MicroTec develop and manufacture a full range of wafer bonder, including manual equipment for R&D and pilot production, through semi to fully automatic models for production level bonding.
The range of permanent and non-permanent equipment is designed for MEMS, advanced packaging, 2.5 & 3D integration, power devices and led applications, plus de-bonders for thin wafer applications.
Capabilities include low-high force bonding, anodic bonding, thermo-compression bonding, eutectic bonding, glass frit bonding, fusion & adhesive bonding etc.
XB8 Wafer Bonder
Universal high-force wafer bond system for up to 100kN and Temperature up to 550°C
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SB6/8 Gen2 Wafer Bonder
Semi-automatic tool for permanent wafer bonding of wafers up to 8″ / 200mm
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XBS200 Wafer Bonder
Automated bond cluster platform for wafer sizes up to 200mm
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SÜSS MicroTec
See the full SÜSS MicroTec product range
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Further Information
Applications
Wafer and Substrate Lithography, Wafer Coating and Cleaning Processes of Micro-Fluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN, Photonic Components etc.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development
SÜSS MicroTec Website
Region
United Kingdom and Ireland
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