Wafer Coating and Developing Equipment by SÜSS MicroTec
SÜSS MicroTec develop and manufacture an extensive range of high-quality manual, semi-automatic and fully automatic wafer coating and developing equipment for lithographic processes used in the R&D and production of semiconductor and related devices.
The manual product line of SUSS MicroTec includes spin coaters, spray coaters and hot plates available in stand-alone or bench mounted configurations.
Semi-automated solutions includes equipment for coating, developing, lift-off and cleaning processes, with models specific for either solvent and aqueous chemistries. These products also offer easy recipe transfer to automated platforms.
SÜSS also specialise in the development and production of fully automated track based cluster tools for up to 200 or 300mm wafers. The systems for resist coating and or developing, can feature up to 3,5 or 6 modules (ACS200), with up to four independent wet process and a maximum of 19 hot plates, to suit the needs of either high-volume manufacturing, or precision low-volume automated processing.
SÜSS wafer coating and developing equipment is also renowned for its exceptional build quality, high yield, reliability and low cost of ownership.
Manual Spin Coating Machine
LabSpin Spin Coating machine for accurate, high quality substrate and wafer coating or develop.
Manual Hot Plate
The HP8 manual hot plate for up to 200mm wafers/substrates designed to meet the requirements of R&D work and small scale production.
Semi-Automatic Resist Coat and Developers
The RCD8 is a custom tailorable spin coat and resist develop platform.
Semi-Automatic Developer, Cleaner or Lift-Off System
Flexible semi-automated tools, for either aqueous or solvent processing.
Automatic Cluster Coating-Developing Track Equipment
The SUSS ACS200 Gen3 platform is a fully automated Coater & Developer platform.
Semi-Automatic Spray Coaters
The AS8/AS12 series dual-line Spray Coaters for up to 200 / 300mm wafers or substrates.
See the full SÜSS MicroTec product range
Tel: +44 (0)1264 334505
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
United Kingdom and Ireland