AS8/12 Semi-Automatic Spray Coaters

AS8/12 Key Features

  • Compact Wafer Coating Equipment
  • Uniform coating even of highly structured surfaces
  • Substrate sizes up to 200mm in diameter
  • Square substrates up to 6″ edge length
  • SUSS Microtec spray design for optimal process stability
  • Up to 2 independent spray dispense systems
  • Recipe controlled process parameters

SUSS Microtec’s AS8 and AS12 platforms are the ideal tools for R&D and low-volume device fabrication.  The systems can process wafers up to 200mm or 300mm diameter respectively, with a maximum 150mm x 150mm edge length for square substrates.

The SUSS Microtec AS8/AS12 series Spray Coaters can be equipped with two independent spray dispense systems avoiding cross contamination; SUSS Microtec’s proprietary spray design, coupled with the sophisticated resist supply system, provides unmatched process stability, repeatability and reproducibility.

All spray and cleaning parameters are programmed and controlled in the on board recipe; this allows for system program transfer to SUSS Microtec’s range of automated tools when the customer see the need for higher throughput.

Further Information

Contact Us

Tel: +44 (0)1264 334505



UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website


United Kingdom and Ireland

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