Manual Spin Coaters
LabSpin Key Features
- Spin Coat, Edge Coat, Develop & EBR-Edge Bead Removal
- Exchangeable Process Bowl for Multiple Users/Processes
- Process Pieces up to 200mm wafers or 150mm Square Substrates
- Stand-alone Table-top or Bench Mounted Versions
- Optional Time Pressure Syringe Dispense
- Optional Fully Automatic Dispense System
- Extensive Range of Tooling/Chucks
- Stores 200 Recipes with 40 Programmable Steps & Loop Functions
- Highest Quality of Results & Performance
SUSS MicroTec‘s LabSpin manual spin coater has been specifically developed for laboratory and R&D applications. Designed for a variety of photolithography chemicals, the LabSpin process station provides uniform, precise and repeatable coating results on the wafer, through its advanced process chamber design. In addition, LabSpin’s can also be used for puddle developing of resists.
The systems are offered in two versions for up to 150 mm or 200 mm wafers, either as table-top (TT) unit or for integration into a wet bench (BM).
The combination of many technical details like the glass cover for maximum chemical resistance, removable process bowl for easy cleaning and the spill free process chamber design makes the series unique.
LabSpin coaters can process a wide range of substrates including round, square and pieces through the available standard and customised chucks.
The small footprint requires only minimum space. In addition, space is further saved by the required vacuum for the chuck being generated internally via a Venturi nozzle and supplied compressed air.
An extensive range of options, complete the system, including: a variable dispense position, enabling standard or edge coating, syringe or automatic dispense system, EBR – edge bead removal, Developer Dispense, Di-Water dispense and N2 drying etc. Whichever configuration is selected, every LabSpin is based on world renowned SUSS process knowledge and quality.
Tel: +44 (0)1264 334505
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
United Kingdom and Ireland