Semi-Automatic Developer, Cleaner or Lift-Off Equipment

AD12/SD12 Key Features

  • Multi-function Tool for Develop, Lift-Off, & Cleaning
  • Dedicated Aqueous (AD-12) or Solvent (SD-12) systems
  • Process Wafers: 50mm – 300mm
  • Process Substrates: 50 x 50mm up to 230 x 230mm
  • Fan spray, Puddle, High-pressure, Binary & Mega-Sonic
  • Sealed Process Chamber with Automatic Safety Door

The AD12 Developer & Cleaner is a flexible semi-automated wet-processing system that offers superior cleaning and developing functions for aqueous media applications, whereas the SD12 Developer & Cleaner is designed for cleaning and developing-lift-off functions utilizing solvent media.

The systems feature processing of pieces through single-wafers up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm.  The ability to handle various media through an expanded process capability makes the SUSS Microtec AD12 or SD12 a highly flexible first choice tool for research & development or small scale production.

Both systems demonstrate versatility by the ability to process multiple substrate types using optimized chucks; even fragile substrates (InP, GaAs) can be securely processed.  Specialised tooling and the extensive range of easily adjustable process parameters make the AD12 and SD12 from SUSS Microtec ideal for any aqueous or solvent based application. 

The systems boast completely sealed process chambers (Stainless steel for the SD12) to ensure an enclosed process environment and avoid chamber corrosion and / or contamination.  The on board media storage unit has a gas exhaust and media leakage sensor; alongside flow controllers and pressure regulators to manage the media.  Optional media temperature control and recirculation systems can be installed in order to improve process repeatability and reduce media consumption.

  • Manual Solvent Resist Developer - Process Chamber

Aqueous AD12 Semi-Automatic Developer and Cleaner Technical Downloads

Solvent SD12 Semi-Automatic, Cleaner & Lift-Off Technical Downloads

Further Information

Contact Us

Tel: +44 (0)1264 334505



UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website


United Kingdom and Ireland

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