Inseto
Inseto

Semi-Automatic Resist Coat and Developers

RCD8 Key Features

  • Small Footprint Semiautomatic Resist Spin Coater
  • Configured as either Coater or Developer
  • Dispense arm (max, 4 dispense line + syringe system)
  • Dispense options from <1 cps to 55 000 cps
  • Open bowl and/or GYRSET® coater
  • Optional Lift Pins / Edge Handling
  • On board nozzle / bowl cleaning
  • Edge Bead Removal and Backside Rinse

SUSS Microtec’s RCD8 coat and develop platform can be tailored to customer requirements from a basic manual spin coater to a GYRSET® enhanced coat and puddle developing tool. It can handle small pieces and standard wafers up to 200 mm in diameter, making the RCD8 the ideal choice for Research & Development work to small scale (pilot) production. 

The optional (patented) GYRSET® rotating closed cover coating technology can be integrated into the RCD8 spin coating module for various photoresists and applications.  This technology enables a wider process window and coating without backside contamination. Furthermore, square substrates and pieces can be coated all the way to the corners with a homogenous resist thickness.

The SUSS Microtec RCD8 is supported by an extensive library of available chucks and configurations, ensuring all kind of substrate materials and shapes can be coated and developed in the machine; where a customer requirement falls outside the standard options, SUSS Microtec’s experienced design team can easily adapt existing chucks or develop new components to meet customer demand.  This platform can be equipped with various well proven dispense line and pump configurations for handling resists with viscosities from <1 cps up to 55 000 cps.

  • RCD8 Semiautomatic Resist Coat and Developer

RCD8 Semi-Automatic Resist Coat and Developer Technical Downloads

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website

www.suss.com

Region

United Kingdom and Ireland

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