Manual & Semiautomatic Die Bonder Equipment by Tresky AG
Since 1980, Tresky AG has been supplying the advanced packaging sectors with innovative manual and semiautomatic die bonder equipment suitable for an extensive range of die attach processes, including: eutectic, epoxy, solder, flip chip, sinter and anisotropic bonding etc.
In addition, where systems are configured with wafer die eject capability, the equipment can be used for a wide range of die sort requirements, including picking and placing die or laser bars into waffle packs, gel packs and other carriers or jigs.
Since their inception, over 1000 Tresky die bonders have been manufactured and installed worldwide to meet critical die attach process, with applications including: Flip Chip Bonding, Laser Diode Manufacturing, Sensor Development and Production, MCM devices, Microelectronic Hybrid Circuits, Chip-on-Board Assemblies, Optoelectronic Components and many more.
Inseto are the exclusive technical distributor and provides full support and application engineering for Tresky die bond equipment throughout the United Kingdom, Ireland & Nordic Regions, including: Finland, Sweden, Norway & Denmark.
T-4909-AE Manual Die Bonding Machine
The T-4909-AE is a low cost, high quality manual die bonder with superior ergonomic design.
T-3002-M Manual Die Bonder & Die Sorter
Excellent performance, ergonomic die bond equipment, ideal for small & medium production of microelectronic assemblies.
T-3000-PRO Semiautomatic Die Bonder
Flexible Die Bonder with semi-automatic process capabilities for standard and advanced packaging applications.
T-3002-PRO Semiautomatic Die Attach & Die Sorter
Equipped with Tresky’s patented die ejector enabling pick-up from wafer for die attach and die sorting.
Flip Chip Bonder
Flip chip bonder systems for die bonding bumped die, or for devices requiring high-precision, device-to-device alignment.
T-3000-HF High Force Die Bonder
Low to high bonding up to 50kg, ideal for sintered silver die attach bonding and high force processes.
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Attach, Chip-on-Board Die Attach, Multi-Chip-Module Assembly, Semiconductor Assembly, Device Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark