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Manual Die Bonding Machine: Tresky T-4909-AE

Tresky T-4909-AE Key Features

  • Low cost manual die bonding machine
  • Small footprint equipment
  • True Vertical Technology™, guarantees parallelism during bonding
  • X-Y air-cushioned 180 x 180 mm placement stage
  • Programmable bond forces 20-400 grams
  • 360 degree freely rotatable pickup spindle
  • Flip Chip Bond Alignment Option
  • For Epoxy, Eutectic, Ultrasonic & Flip Chip Bonding
  • High-quality, Swiss-made

The T-4909-AE (40 Year – Anniversary Edition) is a low-cost manual die bonding machine with a superior ergonomic design. The T-4909-AE features a Raspberry Pi PC with a touch screen control for selection of the pick & place, dispensing, stamping, modes and for programming of the related bonding or dispensing parameters.

The system is suitable for manual die attach of hybrid microelectronic devices including MEMS, MCM’s, MOEMS, VCSEL, RFID, COB etc., using adhesive, eutectic/solder or flip chip processes.

As with all of Tresky’s products, the T-4909-AE incorporates True Vertical Technology™ which guarantees parallelism between the chip and substrate at any bond height. The model now features 95mm of Z axis travel, providing increased clearance for bonding into cavities, or for die on die and flip chip processes etc.

The T-4909-AE die manual die bonding machine’s ergonomic design ensures it is simple to use and operate, resulting in excellent performance and reliability. It is ideal for low volume production, research, development and for Universities, where users require a small footprint die bond machine that is quick and simple to setup and provides accurate placement capability.

In addition, the equipment capability/options include: a 360° rotating pickup tool, adhesive / solder dispenser, epoxy stamping, eutectic scrub, flip chip die bond alignment, pickup tool heating, secondary preform spindle, XY air-cushioned placement stage with micrometre control, which supports the waffle-gel packs, substrate holder and various heating plates.

  • Tresky T-4909 AE Overview

T-4909-AE Manual Die Bonding Machine Downloads

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Tresky T-4909-AE Datasheet

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Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Tresky Website

www.tresky.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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