Tresky T-3002-M Series Manual Die Bonding Systems

Tresky T-3002-M Key Features

  • Manual Die Bonder with pickup from up to 200mm sawn/scribed wafer
  • For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.
  • Precision die to die and die on die placement capability
  • Integrated time pressure dispenser, optional stamping unit
  • True Vertical Technology™, guarantees parallelism during bonding
  • Simple to use with excellent ergonomics & high build quality
  • Modular system covers virtually all die pick-place applications

The T-3002-M Manual Die Bonder is a high precision, operator controlled machine for picking and placing bare semiconductor devices from up to 200mm (8″) wafer or 2/4″ waffle packs or GEL paks, passive components and other devices used in Microelectronic and related assemblies.

The equipment features superior ergonomic design, high-accuracy and a large 220 x 220mm assembly area with 95mm of Z travel, making it ideal for R&D through low volume production or custom assembly requirements.

Applications include:

  • Assembly of Hybrid Microelectronic Devices
  • Conductive & Non Conductive Epoxy Die Attach
  • Eutectic Soldering of Devices
  • Flip Chip Bonding
  • Thermo-compression & Ultrasonic Bonding
  • Epoxy Dispense or Stamping
  • Laser Bar Stacking
  • PCB Chip-on-Board etc.
  • Die Sorting to Waffle or Gel Pak

All models feature Treskys’ True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height, plus integrated time/pressure dispensers.

The modular T-3002 system also includes an extensive range of options, comprising: Beam splitters for Flip-chip applications, Eutectic Scrub & Gas Heating for Eutectic Die Attach, Solder / Epoxy Dispenser, Epoxy Stamping, Pickup Tool Heating, Ultrasonic Bond Heads, Secondary Preform Spindle, Flip Chip Station, Waffle & Gel Pak Tooling, Substrate Holders, Static and Dynamic Heating Plates and alignment / inspection options.

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Tel: +44 (0)1264 334505



Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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