Tresky T-5100 Manual Die Bonder

Tresky T-5100 Key Features

  • Manual Die Bonder with pickup from up to 200mm sawn/scribed wafer
  • Pick & place die from waffle pack, gel pack and tape etc.
  • Sub-micron placement capability
  • For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.
  • Precision die to die and die on die placement capability
  • Integrated time pressure dispenser, optional stamping unit
  • Simple to use with excellent ergonomics & high build quality
  • Modular system covers virtually all die pick-place applications
  • True Vertical Technology™, guarantees parallelism during bonding

The T-5100 is a universal manual die bonder suitable for a wide range of micro-assembly tasks. The equipment features a superior ergonomic design, high-accuracy, a large 220 x 220mm assembly area with 125 mm of vertical travel and an integrated time/pressure dispenser, making it ideal for R&D through low volume production or custom assembly.

Due to the intuitive software, programming and operating the T-5100 is possible with only a few minutes’ training.

The accuracy and repeatability of placing parts is excellent due to features such as a true, linear Z-Axis, Bond Force Control, XY Fine Alignment and high-resolution optics, enabling placement to sub-micron accuracies.

The T-5100-W version features up to a 200mm wafer table, which sits below the main table using Tresky’s latest electronic die ejection system, plus incorporates Treskys’ True Vertical Technology™ that guarantees parallelism between chip and substrate, at any bond height.

The machines rigid base is compact, fits on a lab desk and can be expanded with many different options, including eutectic scrub, gas heating, preform handling, tool heating, ultrasonic bonding, die flip and dynamic heated tooling etc., ensuring the system can be configured to suit even the most demanding manual die bonding requirements.

  • T 5100 22 05audio

Tresky T-5100 Technical Downloads


T-5100 Manual Die Bonder


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Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

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Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

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