Tresky T-5300 Semiautomatic Die Bonder

Key Features:

  • Semiautomatic Die Bonder for precision assembly
  • Automated Z-Drive with bond force control
  • Touch-PC control software for ease of setup and operation
  • For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.
  • Precision die to die and die on die placement capability
  • Integrated time pressure dispenser, optional stamping unit
  • True Vertical Technology™, ensures die parallelism during bonding
  • Simple to use with excellent ergonomics & high build quality
  • Modular system covers virtually all die pick-place applications
  • Pickup from up to 200mm wafers (5300-W version)
  • Integrated UV curing option

The T-5300 semiautomatic die bonder is a high precision, operator-controlled machine for picking and placing bare semiconductor and related devices from waffle packs or GEL paks, passive components and other devices used in microelectronic and related assemblies.

The T-5300 die attach systems incorporate a motorised Z axis, providing active force measurement on every pickup and placement removing operator induced variation, which is ideal for the bonding of delicate devices and for providing precise control of bond-line thickness. Due to the intuitive software, programming and operating the T-5300 is possible with only a few minutes’ training.

The equipment features superior ergonomic design, high-accuracy and a large 220 x 220mm assembly area with 120mm of Z travel, making it ideal for R&D through low volume production or custom assembly requirements.

For applications requiring die pickup from wafer, Tresky offer the T-5300-W version, capable of handling up to 200mm wafers.

Applications include:

  • Semiautomatic Die Bonding of Microelectronic Devices
  • Conductive & Non-Conductive Epoxy Die Attach
  • Eutectic Soldering of Devices
  • Flip Chip Bonding
  • Thermo-compression & Ultrasonic Bonding
  • Epoxy Dispense or Stamping
  • Laser Bar Stacking and Un-stacking
  • PCB Chip-on-Board Assembly etc.
  • Die Sorting to Waffle or Gel Pak

All models feature Treskys’ True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height, plus integrated time/pressure dispensers.

The modular T-5300 semiautomatic die bonder also includes an extensive range of options, comprising: Beam splitters for Flip-chip applications and high accuracy placement, Eutectic Scrub & Gas Heating for Eutectic Die Attach, Solder / Epoxy Dispenser, Epoxy Stamping, Pickup Tool Heating, Ultrasonic Bond Heads, Secondary Preform Spindle, Flip Chip Station, Waffle & Gel Pak Tooling, Substrate Holders, Static and Dynamic Heating Plates and alignment / inspection options.

  • T-5300 Semiautomatic Die Bonder

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T-5300 Semiautomatic Die Bonder Brochure


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Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

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