Manual Wire Bonder by MPP
With over 30 years of wire bonding experience the current range of MPP manual wire bonder’s include the i5000B Ball Bonder, i5000W Wedge Bonder and i5000D Dual Bonder, which has both ball bonding and deep access wedge bonding capabilities.
The equipment is used for process development, production or research of microelectronic and related device interconnect. The systems provide excellent ease of use, optimum bond quality and repeatability, plus the reliability needed for the most challenging bonding applications.
All systems come with semi-automatic and manual operation modes, touch-screen interface, individual bond parameter control, program storage and the capability to handle a wide range of wire diameters, from 18 to 75 micron diameter wire and up to 250 x 25 micron ribbon.
This comprehensive capability enables gold and copper ball bond and stud bumping, coining, single-point TAB bond, thermosonic, aluminium or gold wedge bonding and ribbon bonding.
iBond5000 Wedge Bonder
The latest generation of manual wedge bonder from MPP for ultrasonic fine wire bonding.
iBond5000 Ball Bonder
An advanced manual wire bonder for gold ball bonding or bumping (copper optional).
iBond5000 Dual – Convertible Bonder
Convertible wire bonder between wedge or ribbon bonding and ball bonding with deep access wire feed.
Legacy K&S Manual Wire Bonders
Fully refurbished 2nd user Kulicke and Soffa (K&S) manual ultrasonic gold ball and wedge wire bonding equipment.
Automatic Wire Bonders
Wire Bond and Materials Test Equipment
Bonding Wire and Ribbons
Bonding Wedges and Collets
Wire Bonding Capillaries
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark