iBond5000 Wedge Bonder
iBond5000W Key Features
- Ultrasonic Wedge-Wedge bonder for wire & ribbon bonding
- Bonds Aluminium, Gold, Copper and Silver wire processes
- Programmable looping profiles including lange-coupler mode
- 30/45 and 90 (deep access) degree wire feed configurations
- Consistent tail length control with fine adjust
- Simple to use semiautomatic and manual operation modes
- Comprehensive range of work holders and customised fixtures
- User friendly touch screen graphical user interface
- Large bondable area: 135 mm x 135 mm (5.3” x 5.3”)
The iBond 5000 manual wedge bonder is the latest model from MPP (formerly K&S Manual Wire Bonders Division), for ultrasonic Wedge- Wedge Multiple Stitch & Ribbon bonding using aluminium, gold or copper wires.
The benchtop system features advanced electronics, Windows CE control software and a modern user touch-screen interface. The equipment’s is ergonomically designed and based on the proven 4500 series, ensuring high build quality and consistent results and allows the system to be configured for right hand or left hand operation to suit the operators preference.
The system enables saving and loading of custom files, along with factory pre-configured profiles, for storing, cataloguing, and re-using golden processes. The bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use and caters for various applications. The iBond5000W has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
The model is ideal for process development, production, research and supplemental manufacturing support. It provides excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-board, MEMS , Sensors ,Bio Medical and High Power Devices etc.
Bond and Materials Test Equipment
Coining Bonding Wires
Bonding Wedges and Collets
Automatic Wire Bonders
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark