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Microprof® 200mm Metrology Inspection Tool

Microprof® 200mm Metrology Inspection Tool Key Features

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MA/BA Gen4 Series Mask Aligner for Pieces, Small Substrates and Wafers up to 150mm

The compact, easy to use MA/BA Gen4 Series is a manually loaded system that sets the benchmark in semiconductor submicron research and microsystems production. It is available in three different models, dependent upon the customers applications and requirements. Features and capabilities include:

  • Processing of fragile, warped or part wafers and pieces from a few millimetres up to 150mm
  • Top side, bottom side & infrared alignment capabilities
  • UV250/300/400 Diffraction-reducing exposure optics with fast switching between different wavelengths
  • Precision alignment with either split field microscope or video based targeting
  • Wedge Error Compensation (WEC) for optimal parallelism between substrate and mask
  • Optional Bond Alignment, UV-Nanoimprint Lithography capability
  • MicroProf 200mm Metrology Inspection Tool

Microprof® 200mm Metrology Inspection Tool Technical Downloads

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Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Inspection, Wafer Bond Alignment, Wafer Bonding

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

FRT Website

www.frtmetrology.com

Region

United Kingdom, Ireland & Nordic region

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