Manual Die Sintering Press – P51

Key Features:

  • Manual die sintering press for semiconductor assembly
  • Process assemblies in controlled atmospheres
  • Designed for research, prototyping and low volume production
  • Suitable for Cu-Copper and Ag-Silver Sinter Pastes etc.
  • Manual Z-Drive with force monitoring
  • Process up to 75 x 75 mm assemblies
  • Maximum Sintering Pressure: 40 MPa

The P51 Manual Die Sintering Press is designed for research & development, through to prototyping and low volume production of power semiconductor, LED, RF and other assemblies using sinter pastes for die, substrate, leadframe or component attach.

The easy-to-use P51 manual die sinter press is capable of processing up to 75mm x 75mm devices with a wide range of features and capabilities, including integrated force sensing, substrate pre-heating, a maximum sintering pressure of 40 MPa and clamping force of 16 kN.

With a uniform pressure application and controlled processing atmosphere for nitrogen, forming gas or vacuum, devices can be assembled using either silver or copper sinter pastes etc.

The system is accurate and flexible, with a wide range of options in order to adapt to the customer’s specific manual die sintering requirements.

  • Manual Die Sintering Press - AMX P51

P51 Sinter Press Technical Downloads


P50 Series Datasheet


Related Products

Knowledge Base Articles

Further Information

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Tel: +44 (0)1264 334505



Die attach, Power Module Assembly, IGBT/DBC Attach, Leadframe Attach, Wafer Level Packaging, RF Module Assembly, etc

Industry Segments

Power Semiconductor, RF & Microwave Electronics, LED, Universities R&D, Aerospace and Hi-Reliability Devices etc

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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