Diamond Wafer Scribe Equipment: RV-129
- Accurately diamond scribe up to 200mm Diameter Wafers
- Scribe wafers and substrates up to 10mm thick
- Adjustable scribe angle, length, height and pressure
- Precision scribe alignment via monocular scope and X-axis micrometre
- Rotating chuck with four 90 degree mechanical stops
- Scribe a wide range of materials: Silicon, GaAs, InP, Silica, Glass etc.
ATV produce the RV-129 manual diamond wafer scribe equipment suitable for Universities, Research & Development and for low volume precision scribing of up to 200mm (8″) wafers and substrates.
The precision RV-129 Diamond Wafer Scriber from ATV Technologie is a bench mounted system, which provides accurate scribing / cutting of devices, including wafers (Si, GaAs, InP etc.), ceramics, thin film & PV materials, thick film substrates, glass or silicon components etc.
All essential operating parameters, including the angle of the scribing tool, scribing force, touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeat-ability of results.
The scriber incorporates a rotating X -Y table with universal vacuum chuck for any size wafers up to 8” diameter or square devices up to 8″ x 8″. A 50 X magnification Microscope with cross hair and coaxial illumination allow precise alignment of the scribe tool.
Wafer Dicing Equipment
Plasma Cleaning & Etching
Tel: +44 (0)1264 334505
Cutting, Scribing of: Wafers, Thin Film Devices, PV Materials, Thick Film Components, Glass and Ceramic Substrates etc.
Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark