Diamond Wafer Scribe Equipment by ATV Technologie
ATV produce a range of manual diamond wafer scribe equipment suitable for Universities, Research & Development facilities, Laboratories and for low volume requirements.
The ATV diamond scribers comprise three models, ranging from the precision RV-129 for scribing up to 200mm (8″) wafers and substrates, the the more basic RV-126, which incorporates and alcohol feed system to the scribe tool for improved performance and scribe tool and the RV-127, which is capable of scribing up to 400mm long substrates.
All systems are suitable for accurate and repeatable scribing of silicon wafers, as well as thin and thick film ceramic and glass substrates, including: Ceramics, Borosilicate or Alumino Silicate Glass & Fused Silica Glass Wafers, Silicon, GaAs, InP Wafers and many more.
RV-129 Precision Diamond Scriber
All essential operating parameters are precisely adjustable to ensure optimal flexibility and repeatability of results.
See the full ATV Technologie product range
Tel: +44 (0)1264 334505
Cutting, Scribing of: Wafers, Thin Film Devices, PV Materials, Thick Film Components, Glass and Ceramic Substrates etc.
Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark