Vacuum Reflow Ovens by ATV Technologie
ATV’s solder reflow ovens (SRO) with rapid thermal annealing (RTA), soldering and brazing capability are multi-purpose “cold wall” process ovens heated by IR filaments. The SRO is ideal for R&D and process development, low to high volume production, with models including benchtop through stand-alone to fully automated high volume systems.
Applications include void-free solder die and substrate attach for power semiconductor and hybrid module assembly, formic vacuum solder reflow, hermetic package lid sealing, flux or flux-less soldering, eutectic solder reflow, high vacuum encapsulation, high temperature processing, getter activation, diffusion and compression bonding etc.
SRO-700 Table Top Vacuum Solder Reflow Oven
Ideal for Research and Development or low to medium volume production.
SRO-714 / SRO-716 Batch Vacuum Solder Reflow Ovens
For thermal transfer applications requiring processing under vacuum or with process gases.
Package Lid Sealing with Getter Activation System
Designed for sealing high reliability microelectronic and related packages.
See the full ATV Technologie product range
Tel: +44 (0)1264 334505
Die attach, Power Module Assembly, IGBT/DBC Soldering, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo-electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo-compression bonding, pin fin soldering, Hybrid assembly, MMIC die attachment, brazing etc.
RF & Microwave Electronics, Power Semiconductor, Sensor Fabrication, Universities R&D, Medical, Photonics, Solar Cell, Photo Voltaic and Aerospace and Hi-Reliability Devices etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark