Wafer Furnaces by ATV Technologie

ATV’s PEO range of multipurpose, energy efficient, fast ramping furnaces are designed for semiconductor and related device processing, from R&D through low and medium volume production.

The “hot wall” systems are space saving in their design, incorporating Kanthal® heaters and a removable quartz process chamber, making them ideal for multi-processes including: Oxidation, Annealing, Polyimide Curing, LPCVD, Diffusion, Wet/Dry Thermal SiO2, Epitaxy, HCI-cleaning, Sintering, Reflow etc. The furnaces are available in various models including bench-top versions for 4″ and 8″ wafers/devices and stand-alone versions for 8 & 12″ wafers/devices, in addition to hazardous processes in the PEO-604.

Features include:

• Low energy/gas consumption during stand by process mode
• Loading at room temperature
• Flexible control software with up to 100 steps per program
• Max. 1100°C continuous wafer/substrate temperature
• Excellent low temperature capability
• Ultimate vacuum ~ 5 x 10-6 mbar
• Space saving design
• Fastest ramping: within 15 minutes up to 1,000°C – less 60 minutes to < 100 °C
• Semiconductor grade quartz glass process chamber
• Multipurpose with inter-changeable quartz glass In-liners
• Semi S II safety standards for PH3/B2H6/GeH4/SeH2
• Excellent performance and uniformity