PEO-604 Semiconductor Furnace

PEO-604 Key Features

  • Small footprint wafer furnace for up to 200mm diameter wafers
  • Up to 100 programmable process steps & unlimited process recipes
  • Energy saving by zero energy consumption at ambient / standby
  • Multiple processes by easily exchangeable quartz In-Liners
  • Excellent ramping rates, up to 1000°C in less than 15 minutes
  • < 1ppm Oxygen with 2 times vacuum-N2-backfill routine

ATV’s PEO-604 is a 230mm diameter quartz tube, where the process tube, thermal insulation and heaters are enclosed within an N2 purged and interlocked enclosure, to enable processing of hazardous and flammable materials. In addition to standard oxidation, annealing, diffusion processes etc., the system is capable of processing pyrophoric or highly flammable gases, precursor materials or even toxic gases.

System can process wafers up to 200mm in diameter, with a flat zone within the furnace for up to 50 wafers (temperature uniformity +/- 1.5°C, over 150mm batch). Furnace body is hermetically sealed providing < 1 ppm Oxygen contact with 2 x vacuum N2 back fill routines. Windows based process recipe generation and management system: 100steps per recipe, Step length 1s – 99:59min, process data logging, several user levels, Barcode management and a PLC Controller.

Designed for volume production through wall installation is possible while still retaining easy to access service hatches for preventative and routine maintenance. The PEO 604 has low energy and gas consumption with zero energy loss at Ambient Standby.

The systems are high quality, reliable production tools capable of continuous operation and rapid switching between a variety of complex processes without contamination using the novel “in-liner” principle.

ATV In-liner Concept Overview

PEO-604 in-liner principle for wet/dry thermal oxidation and annealing with gas inlet through door bell jar ball joint into In Liner – by this method, a clean atmosphere is maintained inside it, scarifying the original process tube

  • Run multiple processes in the same furnace
  • Prevents cross contamination across different processes
  • Prevents deposition outside in-liner
  • In-liners are replaceable without leak-check
  • Flexible with wafer boats
  • Easy to replace
  • ATV In-liner Concept

PEO-604 Example Application

Thermal oxidation of silicon

  • Wet oxidation using H2O bubbler for various applications e.g. MEMS
  • Thick oxides e.g. 3 μm SiO2 (30h at 1100°C)
  • Automatic water refill setup

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Further Information

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Tel: +44 (0)1264 334505



Wet Oxidation, Dry Oxidation, P Type Diffusion, N Type Diffusion, Annealing, Vacuum Baking, Thick Film Firing, Glass Paste Firing, and Multiple Processes without cross contamination by ATV’s easily replaceable Quartz In-liner System. LPCVD, CVD, Epitaxy, Polysilicon, Silicon Nitride, LTO, TEOS, solid/liquid/gas precursor diffusion, low k, HSQ, HMDS, Pyrogenic oxidation, VECSEL, MOCVD, Trans LC, Si nano wires, post implanting annealing, carbon nano tubes, Graphene, solar cell, batch ALD, Polyimide/BCB curing, wafer bump reflow, alloying, thick film paste firing, LTCC sintering, annealing under inert atmosphere/Hydrogen/high vacuum, Tellurium/Se/Hg PVD, Thick Film Ceramic Firing etc.

Industry Segments

Universities, Research Development, Semiconductor Production, Medical, Photonics, LTCC, Solar Cell, Photo Voltaic, Compound Fabrication etc.

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