Bumping Equipment and Services by PacTech
PacTech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment used in numerous applications such as micro BGA, wafer level CSP, Optoelectronic (micro optics, fiber attached and lens alignment), Solder stacking (SS Hard drives), MEMS (2D, 2.5D and 3D packaging) and TSV (solder filling of vias).
PacTech is also a worldwide leader in Wafer Level Bumping & Packaging Services. These services meet the high quality demands of customers and support both engineering and prototyping services, as well as high volume production.
Wafer Bumping Equipment
Wafer bumping and reflow equipment from prototype to volume production.
Solder Ball Placement and Re-balling Equipment
Solder bumping equipment, including rework (de-balling & re-balling of BGA’s)
Sub Contract Bumping and Wafer Level Services
Supporting both engineering and prototyping services.
Solder Spheres, Preforms and Ribbons
Materials and Bond Test Equipment
Plasma Cleaning & Etching
Tel: +44 (0)1264 334505
MEMS Packaging, Camera Module Fabrication, Memory, FO WLP, Flip Chip Bumping, BGA Solder Ball Placement, Smart phones and Tablet CSP Packaging, Bio Medical Device Assembly, Sub Contract Wafer Dicing, Sub Contract Wafer Bumping, Sub Contract Solder Bumping
Semiconductor Fabrication, Photonics, Bio Medical, Consumer Electronics, Aerospace, Defence
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark, Netherlands, France & Benelux