Knowledge Base Fact Sheet
Fine Wire Wedge Bond Sequence (IKB-002)
Wedge Bond Sequence: Explanation of the fine wire wedge-wedge bonding cycle to ultrasonically weld electrical interconnects in microelectronics.
The fine wire wedge bond sequence for both manual and automatic equipment can be explained in eight steps:
- STEP 1: RESET / REST / IDLE: Wire is located under the bonding tool between surfaces (chip or lead).
- STEP 2: FIRST SEARCH: Tool descends to first bond search height for final positional (X, Y) adjustment.
- STEP 3: FIRST BOND: Tool brought into contact with surface – force is pre-set value – ultrasonic energy applied for pre-set time to form first bond weld.
- STEP 4: LOOP HEIGHT: Tool is raised to pay wire out from spool (clamps open) to pre-set loop height value.
- STEP 5: LOOP FORMATION: Tool steps back to second bond position (manual or automatic).
- STEP 6: SECOND SEARCH: Tool descends to second bond search height for final positional (X, Y) adjustment.
- STEP 7: SECOND BOND + TERMINATION: Tool brought into contact with surface – second bond made as stage 2.
- STEP 8: TAIL FEED: Following 2nd bond, clamps close and break off wire at bond heel (or via table tear). Wire is then fed back under the tool (tail) for next bond.
For further information on our range of MPP Manual Wire Bonders, please click HERE.
For further information on our range of Kulicke and Soffa Automatic Wire Bonders, please click HERE.
For further information on our range of wirebonding materials, please click HERE.
For further information on our range of wirebonding wedge tools, please click HERE.
05 April 2017
IKB002 Rev. 4