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Laser Solder Ball Jetting

What is Laser Solder Ball Jetting? (IKB-050)

How does laser solder ball jetting technology work?

Within the Jetting Head a singulation disc will dispense a single solder ball into the bottom of a capillary where the laser’s thermal energy melts the solder ball, enabling it to shoot under pressurized nitrogen onto any soldering position being reflowed immediately. The process works with various solder alloys, all with different melting temperatures (SnPb, SnAgCu, SnAg, AuSn, InSn, SnBi….), and requires no solder flux. Therefore, laser solder ball jetting is a clean process.

The localised heat and short pulse period of the laser assures that minimal thermal stress is applied to the areas beyond the joined surfaces. The single solder ball dispensing mechanism required no tooling, enabling flexible soldering location and contactless soldering.

The great advantages of this process are the lowered thermal stress of localized heating and no mechanical contact to substrates or delicate components such as MEMS.

The solder jetting process can be used in a number of applications such as discrete devices, probe-cards, memory, camera modules, wafer pieces, PCB, Flex-substrates, BGAs, CSPs, sensors and 3D components like MEMS.  Target Markets span Defense, Medical, Automotive and Aerospace.

Laser Solder Ball Jetting Dispense Head

Specifications:

  • 40µm to 2mm solder spheres.
  • 80µm to 1mm pad pitch.
Laser Solder Ball Jetting Example Applications

For further information on our range of equipment for Laser Solder Jetting, please click HERE.

Author

Date

Version

Author

Adam Marshall

Date

14 April 2020

Version

IKB050 Rev. 1

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