The 7910 Uno single spindle dicing saw provides a perfect solution for cutting silicon wafers up to 8” and for dicing or scribing discrete devices in production, development and research facilities.
The systems automatic vision system for full and partial wafers, easy to use Graphic User Interface (GUI) with touch-screen control and single low vibration spindle enabling superb cut quality, all combine to deliver the latest innovations, in an advanced small-footprint system.
7900 Series Advantages:
FURTHER INFORMATION ON ADT CUTTING & SCRIBING EQUIPMENT
Tel: +44 (0)1264 334505
Dicing Semiconductor Large Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribbing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.
Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.
Available from Inseto in the United Kingdom, Ireland & Scandinavia