ADT 7900 Series

BENEFITS

  • Advanced dual spindle wafer dicing system
  • Models for up to 200x200mm or 250x250mm devices
  • Quick allignment function for broken or partial wafers
  • Low vibration spindles enable superb cut quality
  • Small footprint & low cost of ownership

DUAL SPINDLE SEMIAUTOMATIC DICING SYSTEMS: ADT - 7900

The 7900 Series - Taking your productivity to the edge.

As part of the growing market to dice small discrete devices and the on-going demand to lower the cost of production per unit, ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.

The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

7900 Series Advantages:

  • Two facing spindles enable simultaneous dicing
  • Low vibration platform
  • Fast automatic alignment and cut positioning increase throughput
  • Small footprint reduces cost of ownership
  • Automatic Kerf inspection increase yield
  • Automatic Y offset correction ensures maximum precision
  • Tape surface detection ensures consistent cut quality
  • Touch screen user interface

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

LED wafer dicing, Dicing Semiconductor Wafers, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribbing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.

Industry Segments

LED, Laser, Diode, Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries..

Technical Papers

ADT Website

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

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Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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