The 7200 Series is offered in three configurations optimized for IC wafer applications, package dicing or hard material applications, with systems available for up to 300mm (12") substrates / wafers.
7200 Series Advantages:
Fully Automatic Dicing Systems Model Range Overview
7222 - Automatic 200mm Wafer Dicing Saw
2" Air-bearing spindle, DC-brushless up to 60krpm. Compatible with 2"- 3" hub and annular blades. Covering up to 200mm round products. Optimized for variety of products such as: Silicon wafers, Thin-film devices, High-brightness LED packages, SAW filters, Glass wafers, IR filters & PZT transducers etc.
7224 - High Power Automatic Dicing System
4", Air-bearing spindle, DC- brushless, up to 2.5KW at 30krpm. Compatible with 4" and 5” annular blades. Covering up to 200mm round products. Optimized for thick and hard materials, including: Ceramic substrates, Alumina (LTCC, HTCC) & Hybrids etc.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing or Dicing Ceramic Components, Cutting Glass, Dicing MEMS Devices, PCB Package Singulation etc., Passive Component Green Ceramic Cutting.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Filter Manufacturing
Available from Inseto in the United Kingdom, Ireland & Scandinavia