ADT 7220 Series

FULLY AUTOMATIC DICING SYSTEMS: ADT - 7220 SERIES

The 7200 Series is offered in three configurations optimized for IC wafer applications, package dicing or hard material applications, with systems available for up to 300mm (12") substrates / wafers.

7200 Series Advantages:

  • Unique Wx3 wafer handling system streamlines productivity
  • Continuous digital magnification system for optimal vision setup
  • Special algorithm predicts blade wear rates
  • Blade wear algorithm reduces height measurements & increases UPH
  • Touch panel display supports a user-friendly graphical interface (GUI)
  • Atomized wafer cleaning technology for superior process results
  • Dedicated dressing cassette enables automatic blade dressing
  • Built-in Inspection tray allows for in-process quality assessment

Fully Automatic Dicing Systems Model Range Overview

7200 - 2-3" ProDice Fully Automatic Saw & Scribing System

7222 - Automatic 200mm Wafer Dicing Saw

2" Air-bearing spindle, DC-brushless up to 60krpm. Compatible with 2"- 3" hub and annular blades. Covering up to 200mm round products. Optimized for variety of products such as: Silicon wafers, Thin-film devices, High-brightness LED packages, SAW filters, Glass wafers, IR filters & PZT transducers etc.

7200 - 4" Fortis Semiautomatic Dicing For Thick & Hard Materials

7224 - High Power Automatic Dicing System

4", Air-bearing spindle, DC- brushless, up to 2.5KW at 30krpm. Compatible with 4" and 5” annular blades. Covering up to 200mm round products. Optimized for thick and hard materials, including: Ceramic substrates, Alumina (LTCC, HTCC) & Hybrids etc.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Wafers, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing or Dicing Ceramic Components, Cutting Glass, Dicing MEMS Devices, PCB Package Singulation etc., Passive Component Green Ceramic Cutting.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Filter Manufacturing

ADT Website

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416