ADT produce a range of high-precision large area dicing systems including the 7130 for processing up to 300mm (12") wafers, in addition to the cutting of large PCB substrates or hard and brittle glass and ceramic substrates. Whilst the 7100XLA model can handle even larger substrates, PCB and other devices up to 450x600mm in size. All systems are available with either 2" or 4" spindles.
Features & Benefits:
Semiautomatic Dicing Systems Model Range Overview
7132 - 300mm Wafer Dicing System
Front mount 2" air bearing spindle, up to 1.2KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2" - 3" hub and annular blades. Covering up to 300mm (12" x 12" products).
7134 - High Power Dicing System
4", DC-brushless, 2.5 kW, air-bearing spindle, (30 krpm Max.), with closed-loop turntable. Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 300 mm (12" x 12" products).
7100XLA - Extra Large Area Dicer
4", DC-brushless, 2.5 kW, Air-bearing Spindle, (30 krpm Max.), with closed-loop turntable Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 450 mm x 600 mm panels etc.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Dicing Semiconductor Large Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribbing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.
Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.
Available from Inseto in the United Kingdom, Ireland & Scandinavia