Large Area Dicing Saws For Wafers, Substrates, PCB's, Glass etc.

LARGE AREA DICING SAWS

ADT produce a range of high-precision large area dicing systems including the 7130 for processing up to 300mm (12") wafers, in addition to the cutting of large PCB substrates or hard and brittle glass and ceramic substrates. Whilst the 7100XLA model can handle even larger substrates, PCB and other devices up to 450x600mm in size. All systems are available with either 2" or 4" spindles.

Features & Benefits:

  • Large dicing systems for up to 450x600mm (18" X 24") devices
  • Unique multi-panel processing capabilities
  • Advanced hardware platform for high reliability & low maintenance
  • High & low power Spindle options
  • Customized chucks configurations
  • Increased theta precision for high accuracy over long cut lengths
  • Spacious load & unload area for large substrates

Semiautomatic Dicing Systems Model Range Overview

7100 - 2" Vectus Semiautomatic Saw & Scribing System

7132 - 300mm Wafer Dicing System

Front mount 2" air bearing spindle, up to 1.2KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2" - 3" hub and annular blades. Covering up to 300mm (12" x 12" products).

7134 - High Power 300mm Dicing Saw with a 4" Spindle

7134 - High Power Dicing System

4", DC-brushless, 2.5 kW, air-bearing spindle, (30 krpm Max.), with closed-loop turntable. Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 300 mm (12" x 12" products).

7100XLA Extra Large Area Dicing System

7100XLA - Extra Large Area Dicer

4", DC-brushless, 2.5 kW, Air-bearing Spindle, (30 krpm Max.), with closed-loop turntable Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 450 mm x 600 mm panels etc.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Large Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribbing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.

Industry Segments

Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.

ADT Website

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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