ADT offer a broad range of peripheral equipment that, along with their dicing systems, provides comprehensive and complementary solutions for our customers.
We offer off-the-shelf configurations as well as tailor-made modifications to comply with specific customer requirements.
Peripheral Dicing Equipment Overview
Spindle Coolant Chiller - Model 937
Stabilize your process with a cost-effective solution. The ADT 937 Chiller is designed to provide cooling water for the saw spindle. The water circulates from the chiller to the spindle and back, and maintains a constant flow and temperature level. Compact design, small footprint; High Capacity (one system for two spindles); safe monitoring of temperature, flow and fluid level; Microprocessor controller for easy setup and operation; Reduces operation costs by eliminating the need for water treatment; Protects the spindle from lime scale, corrosive dissolved minerals and particulates found in tap water.
CO2 Re-Ionizer System - Model 947
The ADT 947 DI Water Re-ionizers are designed to eliminate particle adhesion and device damage caused by electrostatic effects. The units dissolve CO2 gas into de-ionized water (DI) used for dicing or cleaning processes, thus performing consistent control over an optimal level of resistivity. System Highlights:
Water Control Circulation System - Model 921
Improve your dicing process with our environment friendly system. The CLF 921 Water Control Circulation Systems creates an optimal emulsion for cooling the blade by constantly mixing, cooling and filtering water used during the dicing process with a suitable additive, helping ensure consistent cut cutting quality and prolonging blade life. The system offers provides environmentally- friendly conditions, integrating with up to two ADT saws simultaneously.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, PCB Package Separation, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices, Glass Device Processing
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Processing
Available from Inseto in the United Kingdom, Ireland & Scandinavia