ADT's 7120 Series of Semiautomatic Dicing Systems for 50-200mm devices, cover the full spectrum of dicing materials from IC wafers to pcb packages and hard material applications. The systems offers the lowest possible cost-of-ownership, whilst providing the most advanced dicing technology.
7120 Series Advantages:
Semiautomatic Dicing Systems Model Range Overview
7122 Wafer Dicing System
Front mount 2" air bearing spindle, up to 1.2KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2"- 3" hub and annular blades. Covering up to 8" x 8" products. The system is equipped with close loop turn table, optimized for variety of products such as: Silicon wafers, Thin-film devices, High-brightness LED Packages, SAW Filters, Glass/Silicon Sensors, PZT and more.
7124 High Power Dicing System
4", DC-brushless, 2.5 kW, air-bearing spindle, (30 krpm Max.), with closed-loop turntable. Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 200 mm x 200 mm, such as: - Glass - DWDM Optical Filters - Thick Ceramic Substrates.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Manual and Semiautomatic Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices, Glass Device Processing
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
Available from Inseto in the United Kingdom, Ireland & Scandinavia