The 967 Semiautomatic Wafer Mounter from ADT is a small footprint user friendly system for automatic bubble free mounting for wafers up to 200mm, onto either standard blue or UV tapes.
The 967 provides fast, accurate mounting, avoiding the risks associated with manual systems. Once set, the same sequence is used for each wafer, thus ensuring high quality and consistent results. Process parameters, such as Roller pressure, Chuck temperature and Mounting speed, can easily be set using the user-friendly interface.
The 967 Wafer Mounter is also designed to minimise or reduce mounting costs, using all standard dicing tapes (pre-cut tape is not required), lowering the tape usage by as much as 25% compared to manual mounting. The low air and power consumption makes the 967 very economic.
ADT 967 Semiautomatic Wafer Mounter Specifications
Dicing blue tapes / UV tapes
DTF 2-8-1; DTF 2-6-1; 350-103; 350-104
Round 6", 8"
< 30 seconds
304 x 800 x 394 mm 330 x 1000 x 560 mm
Temp Controlled Chuck heater:
Up to 65 °C
Internal vacuum generator to hold workpieces
Backing tape collector:
Backing tape collecting mechanism for UV tape
Dimensions ( W X D X H ):
655 mm x 590 mm x 560 mm
Optional Custom chucks:
Multi Panels, Non Contact
Optional Frame Types:
4" frame, 5" frame
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Automatic Mounting Wafers, Substrates, PCB's, Glass, Metals Parts and Ceramics Devices etc., onto Blue or UV Tapes for Dicing or Scribing
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Processing
Available from Inseto in the United Kingdom, Ireland & Scandinavia