Amadyne SAM42 Semi-automatic Die Attach Machine

LOW-MEDIUM VOLUME FLXIBLE DIE ATTACH: AMADYNE - CAT

The “CAT - Clever Assembly Tool for Advanced Packaging” from Amadyne is a standalone system designed for the assembly of microelectronic and related devices. Featuring short setup and changeover times, the CAT is a versatile system with easy integration of customer specific requirements.

The CAT is designed for R&D through medium volume die attach and assembly operations, offering exceptional flexibility. It utilises the latest mineral molded casting technology for rigidity, precision liner axis for X-Y positioning, advanced image processing algorithms for component alignment and intuitive software technology for ease of programming and operation.

Other features and options include a 300x400mm working area, automatic tool changeover, dispenser, stamping, eutectic station, chip eject, tape feeders, upward looking vision and inspection options.

The CAT is capable of assembling the widest range of devices, including Single-Chip, Multi-Chip, COB, Flip Chip, Chip on Chip etc. Dice can be handled in all commonly available presentation forms i.e. Wafer, Waffle Pak, GEL PAK and Tape Feeder etc.

The system features include:

  • Flexible System for Die Attach & Assembly Operations
  • Linux operating system with graphical user interface
  • Large multi-function work-area 300x400mm
  • Pick up from wafer
  • Pick up from tape & reel, waffle pack, gel pack etc.
  • Die flip chip option
  • Dispensing, epoxy writing or epoxy transfer
  • Integrated vision with upward and downward camera options
  • Manual operator driven or fully automatic assembly modes
  • Wafermapping
  • Post place inspection
  • Remote maintenance system
  • Tracking of production data
  • Easy integration of customer specific processes

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Technical Papers

Amadyne Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Full Name

Company

Country

Email

Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416