The “CAT - Clever Assembly Tool for Advanced Packaging” from Amadyne is a standalone system designed for the assembly of microelectronic and related devices. Featuring short setup and changeover times, the CAT is a versatile system with easy integration of customer specific requirements.
The CAT is designed for R&D through medium volume die attach and assembly operations, offering exceptional flexibility. It utilises the latest mineral molded casting technology for rigidity, precision liner axis for X-Y positioning, advanced image processing algorithms for component alignment and intuitive software technology for ease of programming and operation.
Other features and options include a 300x400mm working area, automatic tool changeover, dispenser, stamping, eutectic station, chip eject, tape feeders, upward looking vision and inspection options.
The CAT is capable of assembling the widest range of devices, including Single-Chip, Multi-Chip, COB, Flip Chip, Chip on Chip etc. Dice can be handled in all commonly available presentation forms i.e. Wafer, Waffle Pak, GEL PAK and Tape Feeder etc.
The system features include:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark