FLEXIBLE MICROELECTRONICS ASSEMBLY & AUTOMATIC DIE BONDING SYSTEMS BY AMADYNE

Amadyne produce fully automatic die bonding equipment for the automation of production bonding processes, including epoxy die bond, eutectic die attach and adhesive dispensing within the Microelectronic and related manufacturing sectors.

With over 20 year's experience of industrial automation, they offer a range of standard products (see FAB & CAT), and specialist automation solutions for microsystems assembly.

Amadyne's standard products include the sophisticated FAB Series of Fast Automatic Die Bonders and the CAT-Clever Assembly Tool for automatic batch assembly of die attach processes in microelectronics devices and advanced packaging applications.

Product range overview

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Amadyne FAB1 Flexible Die Bonder
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Fast Automatic Bonder (FAB) offers improved speed and accuracy and incorporates the very latest in motion control & software technology, whilst not compromising on flexibility. The system is housed inside a novel cabinet, which incorporates particulate control filters, system status illuminators and an exceptional working area that can accommodate up to two wafers for parallel processing. System features include:

  • Elegant Graphical User Interface
  • Large Working Area
  • On The Fly Flip Chip
  • High Pick & Place Accuracy
  • Customer Specific Integration
  • Automatic Tool Change
  • 1x 300mm or 2x200mm Wafer Capability
  • Inline or Batch Configurations
Amadyne CAT Flexible Batch Die Bonder
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Amadyne's automatic batch system, which is new concept in pick and place capable of die and component assembly in a small footprint. The CAT is designed for R&D through low-medium volume microelectronics assembly operations and offers exceptional flexibility, using some of the latest positioning, image processing, electronics and software technology available.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Amadyne Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416