The EMU from Amadyne is a standalone automated die bond system designed for the batch assembly of microelectronic and related devices. Featuring short setup and changeover times, the system is very versatile and ideal for R&D through to low volume die attach and assembly operations.
The system utilises advanced image processing algorithms for component alignment and an intuitive graphical user interface for ease of programming, with operation via a 23" TFT Monitor.
A bond head with 360° rotation and integrated touchdown sensor features quick change pickup tool holders, with an optional five position tool bank for automated tool change-overs. Other features include a 250x300mm presentation level and 102mm of travel in the Z axis. Further capabilities include: adhesive dispense, epoxy stamping, eutectic soldering station, upward looking vision and inspection options etc.
The EMU is capable of assembling the widest range of devices, including Single-Chip, Multi-Chip, COB, Chip on Flex, Flip Chip, Chip on Chip etc.
The system features include:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark