The fab¹ is a versatile automatic die attach system capable of handling an extensive range of components of different sizes, as well as for applying adhesives.
Flexibility, ease of operation and a wide variety of options in a compact footprint, permit the fabrication of standard and advanced micro-system devices. The equipment’s open architecture also permits non-standard and customised processes to be easily integrated.
The system is capable of batch or inline processing, with excellent user access for loading and unloading product. A sophisticated graphical user interface (GUI) with expert panels for step by step guidance simplifies both programming and operation.
The fab modules also offer an extensive list of software and hardware features.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark