The new fab1 modules provide the same rich features, ease of use and high flexibility the SAM42 is famous for. In Addition the new machines also provide something repeatedly requested: SPEED!
Fab1 is a completely new design, regarding software as well as hardware. Some Highlights
The fab modules also offer an extensive list of software and hardware features.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark