Amadyne FAB1 Flexible Die Bonder

FULLY AUTOMATIC DIE BONDER FOR ADVANCED PACKAGING: AMADYNE FAB¹

The fab¹ is a versatile automatic die attach system capable of handling an extensive range of components of different sizes, as well as for applying adhesives.

Flexibility, ease of operation and a wide variety of options in a compact footprint, permit the fabrication of standard and advanced micro-system devices. The equipment’s open architecture also permits non-standard and customised processes to be easily integrated.

The system is capable of batch or inline processing, with excellent user access for loading and unloading product. A sophisticated graphical user interface (GUI) with expert panels for step by step guidance simplifies both programming and operation.

System features:

  • X,Y,Z & T handling of components
  • Standard & advanced packaging processes: COB, MCM, COC, FC, Flip Chip etc.
  • Single or double level systems with extensive working areas
  • Multiple input presentation formats: Wafer, SMT, Waffle, Carrier etc.
  • Handling non-standard components: Substrates, Lids, Carriers etc.
  • Multiple output presentation formats: PCB, Substrate, Packages, WP, Wafer, Boat, Tray etc.
  • Different methods for applying adhesives: stamping, jetting, dispensing etc.
  • Stand alone or In-line configurations
  • Heated substrate or pickup tooling available
  • Advanced graphical user Interface with OPT & CAD Import
  • Integrated clean environment with Filtration Flow Box
  • Automatic tool change with 20 positions
  • Magazine or presentation lifters
  • Open architecture with customization possible
  • Low cost of ownership

The fab modules also offer an extensive list of software and hardware features.

FAB Dispense Service Module

Graphical User Interface

FAB Dispense Service Module

Dispense Service Module

FAB Dispense Service Module

Process Control Module

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Technical Papers

Amadyne Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Full Name

Company

Country

Email

Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416