The ATV SRO 700 Vacuum Solder Reflow Oven is a small-footprint, bench-top system, ideal for R&D or low to medium volume production. The system produces high-quality results and is designed for multiple solder reflow processes, including: fluxless, eutectic die attach, gold tin soldering, void free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.
Reflow profiles are created simply using ATV's WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile. Products are then reflowed via IR lamps in the polished stainless steel cold-walled reflow chamber, in a controlled environment, resulting in excellent void free solder joints.
The SRO700 features include:
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Tel: +44 (0)1264 334505
Die attach, Power Module Assembly, IGBT/DBC Soldering, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo-electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo-compression bonding, pin fin soldering, Hybrid assembly, MMIC die attachment, brazing etc.
Power Device Production, Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark