SEMICONDUCTOR PROCESS FURNACES

ATV's PEO range of multipurpose, energy efficient, fast ramping furnaces are designed for semiconductor and related device processing, from R&D through low and medium volume production.

The "hot wall" systems are space saving in their design, incorporating Kanthal® heaters and a removable quartz process chamber, making them ideal for multi-processes including: Oxidation, Annealing, Polyimide Curing, LPCVD, Diffusion, Wet/Dry Thermal SiO2, Epitaxy, HCI-cleaning, Sintering, Reflow etc. The furnaces are available in various models including bench-top versions for 4" and 8" wafers/devices and stand-alone versions for 8 & 12" wafers/devices, in addition to hazardous processes in the PEO-604.

Features include:

  • Low energy/gas consumption during stand by process mode
  • Loading at room temperature
  • Flexible control software with up to 100 steps per program
  • Max. 1100°C continuous wafer/substrate temperature
  • Excellent low temperature capability
  • Ultimate vacuum ~ 7 x 10-7 mbar
  • Space saving design
  • Fastest ramping: within 15 minutes up to 1,000°C - less 60 minutes to < 100 °C
  • Semiconductor grade quartz glass process chamber
  • Multipurpose with inter-changeable quartz glass In-liners
  • Semi S II safety standards for PH3/B2H6/GeH4/SeH2
  • Excellent performance and uniformity

Product Range Overview

PEO-601 - 100mm Quartz Tube Furnace by ATV
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The PEO-601 is a table-top quartz tube furnace for processing up to 100mm (4") diameter wafers or substrates and is ideal for research and development or low volume production applications, including oxidation, annealing, baking and thick film/glass paste firing etc., or for multiple processes without cross contamination by ATV's easily replaceable quartz in-liner system..

PEO-604 - 200mm Quartz Tube Furnace for Hazardous Processes by ATV
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The PEO 603/4 Semiconductor quartz tube furnace for processing up to 200mm (8") diameter wafers or substrates and is ideal for research and development through to medium volume production applications, or for multiple processes without cross contamination by ATV's easily replaceable quartz in-liner system. It is suitable for processing up to 1100 Degrees C and is also designed for applications with:

 

Enhanced thermal strain
Pyrophoric and explosive gases
Toxic gases
Processes with precursors

 

Other applications include: Thermal oxidation of silicon, Low temperature oxide, TEOS oxide, High temperature oxide, Poly and α-silicon, Epitaxy, Silicon Nitride, MOCVD, Carbon Nanotubes & Annealing, baking and thick film/glass paste firing etc.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

LPCVD, CVD, Epitaxy, Polysilicon, Silicon Nitride, LTO, TEOS, solid/liquid/gas precursor diffusion, low k, HSQ, HMDS, wet/dry thermal oxide, Pyrogenic oxidation, VECSEL, MOCVD, Trans LC, Si nano wires, post implanting annealing, carbon nano tubes, Graphene, solar cell, batch ALD, Polyimide/BCB curing, wafer bump reflow, alloying, thick film paste firing, LTCC sintering, annealing under inert atmosphere/Hydrogen/high vacuum, Tellurium/Se/Hg PVD, Thick Film Ceramic Firing

Industry Segments

Universities, Research Development, Semiconductor Production, Medical, Photonics, LTCC, Solar Cell, Photo Voltaic, Compound Fabrication etc.

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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