ATV's PEO range of multipurpose, energy efficient, fast ramping furnaces are designed for semiconductor and related device processing, from R&D through low and medium volume production.
The "hot wall" systems are space saving in their design, incorporating Kanthal® heaters and a removable quartz process chamber, making them ideal for multi-processes including: Oxidation, Annealing, Polyimide Curing, LPCVD, Diffusion, Wet/Dry Thermal SiO2, Epitaxy, HCI-cleaning, Sintering, Reflow etc. The furnaces are available in various models including bench-top versions for 4" and 8" wafers/devices and stand-alone versions for 8 & 12" wafers/devices, in addition to hazardous processes in the PEO-604.
Product Range Overview
The PEO-601 is a table-top quartz tube furnace for processing up to 100mm (4") diameter wafers or substrates and is ideal for research and development or low volume production applications, including oxidation, annealing, baking and thick film/glass paste firing etc., or for multiple processes without cross contamination by ATV's easily replaceable quartz in-liner system..
The PEO 603/4 Semiconductor quartz tube furnace for processing up to 200mm (8") diameter wafers or substrates and is ideal for research and development through to medium volume production applications, or for multiple processes without cross contamination by ATV's easily replaceable quartz in-liner system. It is suitable for processing up to 1100 Degrees C and is also designed for applications with:
Enhanced thermal strain
Pyrophoric and explosive gases
Processes with precursors
Other applications include: Thermal oxidation of silicon, Low temperature oxide, TEOS oxide, High temperature oxide, Poly and α-silicon, Epitaxy, Silicon Nitride, MOCVD, Carbon Nanotubes & Annealing, baking and thick film/glass paste firing etc.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
LPCVD, CVD, Epitaxy, Polysilicon, Silicon Nitride, LTO, TEOS, solid/liquid/gas precursor diffusion, low k, HSQ, HMDS, wet/dry thermal oxide, Pyrogenic oxidation, VECSEL, MOCVD, Trans LC, Si nano wires, post implanting annealing, carbon nano tubes, Graphene, solar cell, batch ALD, Polyimide/BCB curing, wafer bump reflow, alloying, thick film paste firing, LTCC sintering, annealing under inert atmosphere/Hydrogen/high vacuum, Tellurium/Se/Hg PVD, Thick Film Ceramic Firing
Universities, Research Development, Semiconductor Production, Medical, Photonics, LTCC, Solar Cell, Photo Voltaic, Compound Fabrication etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark