ATV SRO Getting Lid Activation and Reflow Systems

PACKAGE LID SEALING REFLOW OVENS WITH GETTER ACTIVATION

ATV's proven SRO series of solder reflow ovens are extensively used for standard void free lid-sealing applications on ceramic, multi-layer LTCC and other hybrid packages. Where Getter activation is required, ATV have developed enhanced solutions, which provide improved vacuum capability for MEMS and other applications, thermal getter activation whilst protecting the core package temperature and precision tooling for package to lid alignment etc.

Reflow profiles are created simply using ATV's WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile.

The system features include:

  • Proven ATV quality, components and reliability
  • Small Footprint Free-Standing Systems
  • Top and Bottom Heater Arrays
  • Independent temperature control of lids and packages
  • High flexibility: different packages at same time possible
  • Ultimate Vacuum: ~ 7 x 10-7mbar
  • High alignment precision of lids and packages
  • Ramping up > 3.5°C/sec
  • Ramping down > 2°C/sec
  • Up to 100 process steps per reflow profile
  • Oxygen < 0.1 ppm
  • Unlimited Process Recipes

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, Low moisture package sealing, Getter activation, Void free lid-sealing OF ceramic, multi-layer LTCC and other hybrid microelectronic packages.

Industry Segments

Universities, Research Development, Production, Semiconductor, Medical, Photonics, Aerospace, Military, Space, High-Reliability Microelectronics etc.

ATV Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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