ATV's proven SRO series of solder reflow ovens are extensively used for standard void free lid-sealing applications on ceramic, multi-layer LTCC and other hybrid packages. Where Getter activation is required, ATV have developed enhanced solutions, which provide improved vacuum capability for MEMS and other applications, thermal getter activation whilst protecting the core package temperature and precision tooling for package to lid alignment etc.
Reflow profiles are created simply using ATV's WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile.
The system features include:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
High vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, Low moisture package sealing, Getter activation, Void free lid-sealing OF ceramic, multi-layer LTCC and other hybrid microelectronic packages.
Universities, Research Development, Production, Semiconductor, Medical, Photonics, Aerospace, Military, Space, High-Reliability Microelectronics etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark