ATV Technologie GmbH located in Munich, Germany and founded in 1972 manufacture a range of equipment for various thermal processes, including high-precision semiconductor quartz tube furnaces, vacuum solder reflow equipment, hot plates, sintering presses, atomic layer deposition equipment, as well as diamond scribing systems for wafers and other devices.
ATV Technologies prides itself on providing high quality, versatile systems engineered according to the customer’s specific requirements.
Product range overview
For Semiconductor and advanced electronic research or production, the PEO range of Quartz Tube Furnaces, feature fast ramping and cooling in a space saving & energy efficient design. They can reach temperatures ranging to 1100°C with devices up to 300mm diameter. Systems can achieve Vacuum down to 5 x 10-6 mbar/Torr, Oxygen levels < 1ppm, have multiple process gases and a pure Hydrogen option. Applications uses include LPCVD, Epitaxy, Annealing, Diffusion, Wet/Dry Thermal Processes, HCI-Cleaning, Polyimide Curing, Alloying, Oxidation, low k Dielectrics, Wafer Bump Reflow, Fluxless Reflow Soldering, LTO, Thick-film Paste & LTCC Sintering etc.
For Thermal Transfer Applications requiring processing under vacuum, or with process gases, including Void Free Solder Reflow, Package Lid Sealing, Annealing Die Attach & Substrate Bonding, Alloying, Flip Chip / Thermo-compression Wafer Bonding, Flip Chip Bump Reflow, Popcorn Effect Analysing & other rapid thermal processes etc.
PHP - Sintering Press
The PHP Sintering Press is designed for LTCC and other sintering applications where the control of temperature and pressure are process critical parameters. The PHP is a maintenance free pneumatically driven sinter press unit for up to 50 kN, min. 500 N, ± 1% @ 20kN pressures. The press incorporates ATV's proven furnace technology for processing sintered components up to 1000 degrees C.
For Accurate Scribing Of Ceramic Components, Glass Substrates and Silicon Wafers. Various models available with options including Vacuum Chucks, Fine Adjust & Cross Hair Alignment, for scribing up to 220mm scribe lines (model dependent).
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Semicondcutor Wafer Fabrication, Hybrid Assembly, Vacuum Solder Reflow, Brazing, Production Of Microelectronic Devices, Multi-Chip-Modules, Eutectic Solder Reflow, Microwave Module Assembly, Power Hybrid Assembly, Wafer and Glass Scribing and Sintering, Terhmoscompression Bonding etc.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark