ATV SRO Series Stand Alone Vacuum Solder Reflow Systems

VACUUM SOLDER REFLOW BATCH OVENS - ATV SRO-714 / SRO-716

ATV's SRO 714 & 716 models are free-standing Vacuum Solder Reflow Ovens for batch processing with rapid thermal annealing and brazing capability. The systems are IR lamp heated multi-purpose "cold wall" process ovens. These models are ideal for R&D, process development as well for low to high volume production.

Reflow profiles are created simply using ATV's WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile. Options include formic acid processing for flux-free soldering, advanced flux management for solder paste applications, H2/forming gas and Over-Pressure capability, O2 and moisture monitoring etc.

The 714 & 716 systems produce exceptional results, achieving less than 1% temperature variation across their heated area. They are designed for multiple solder reflow processes, including: fluxless, eutectic die attach, gold tin soldering, package brazing, void free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.

The system features include:

  • Proven ATV quality, components and reliability
  • Small Footprint Free-Standing Systems
  • Touch TC's with Quick Swap Heating Plates
  • 450°C (option to 750°C)
  • Heated Area up to 314x314 (SRO-716)
  • Ramping up > 3.5°C/sec
  • Ramping down > 2°C/sec
  • Automatic Chamber Opening/Closing
  • Rapid single wafer processing > 50°C/second
  • Up to 100 process steps per reflow profile
  • Oxygen < 0.1 ppm
  • Ultimate Vacuum: ~ 7 x 10-7mbar
  • Unlimited Process Recipes
  • High pressure atmosphere: up to 3 bar (abs)
  • Flux less, with flux and solder paste options
  • Formic acid activated nitrogen
  • Automation Options

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die attach, Power Module Assembly, IGBT/DBC Soldering, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo-electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo-compression bonding, pin fin soldering, Hybrid assembly, MMIC die attachment, brazing etc.

Industry Segments

Power Device Production, Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.

ATV Website

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416