ATV's SRO 714 & 716 models are free-standing Vacuum Solder Reflow Ovens for batch processing with rapid thermal annealing and brazing capability. The systems are IR lamp heated multi-purpose "cold wall" process ovens. These models are ideal for R&D, process development as well for low to high volume production.
Reflow profiles are created simply using ATV's WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile. Options include formic acid processing for flux-free soldering, advanced flux management for solder paste applications, H2/forming gas and Over-Pressure capability, O2 and moisture monitoring etc.
The 714 & 716 systems produce exceptional results, achieving less than 1% temperature variation across their heated area. They are designed for multiple solder reflow processes, including: fluxless, eutectic die attach, gold tin soldering, package brazing, void free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.
The system features include:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Die attach, Power Module Assembly, IGBT/DBC Soldering, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo-electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo-compression bonding, pin fin soldering, Hybrid assembly, MMIC die attachment, brazing etc.
Power Device Production, Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark