ATV's solder reflow ovens (SRO) with rapid thermal annealing (RTA), soldering and brazing capability are IR lamp heated multi-purpose "cold wall" process ovens. The SRO is ideal for R&D, process development as well for low to high volume production, with models including benchtop through stand-alone to fully automated high volume systems.
Applications include void-free solder die and substrate attach for power semiconductor and hybrid module assembly, formic vacuum solder reflow, hermetic package lid sealing, fluxless soldering, eutectic solder reflow, high vacuum encapsulation, high temperature processing, getter activation, diffusion and compression bonding etc.
Product range overview
Ideal for Research and Development or low to medium volume production. The SRO 700 system is a vacuum solder reflow oven for various soldering processes, including: flux less soldering, formic acid soldering, eutectic die attach, void free soldering, hermetic lid sealing and flip chip bump reflow soldering etc.
For Thermal Transfer Applications requiring processing under vacuum, or with process gases, including Void Free Solder Reflow, Package Lid Sealing, Annealing Die Attach & Substrate Bonding, Alloying, Flip Chip / Thermo-compression Wafer Bonding, Flip Chip Bump Reflow, Popcorn Effect Analysing & other rapid thermal processes etc.
Utilising an enhanced version of ATV's SRO Solder Reflow Ovens, the Lid Getter activation system is designed for sealing high reliability microelectronic and related packages, whilst activating lid getters during the same process.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Die attach, Power Module Assembly, IGBT/DBC Soldering, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo-electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo-compression bonding, pin fin soldering, Hybrid assembly, MMIC die attachment, brazing etc.
RF & Microwave Electronics, Power Semiconductor, Sensor Fabrication, Universities R&D, Medical, Photonics, Solar Cell, Photo Voltaic and Aerospace and Hi-Reliability Devices etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark