Nordson DAGE 4600 Automated Wire Pull, Bond Bump Shear and Pull Tester

AUTOMATED BOND TESTER - Nordson DAGE 4600

The 4600 Bondtester automates the traditional manual bond testing processes, including wire pull, bond shear and cold-bump pull of microelectronic and semiconductor devices, in order to reduce handling errors and increase the efficiency of the quality assurance process.

The system utilises high-accuracy positioning stages with sub-micron resolution-repeatability, advanced optics and a sophisticated graphical user interface with easy-to-use automation software, to provide operator free testing of simple through multi-surface complex products with ease.

Equipment features include:

  • Fiducial alignment for parent and sub-surfaces
  • Correction for tool concentricity
  • Abnormal test detection
  • Automated debris removal
  • Wizard guides for simplified programming
  • Step and repaet test patterns
  • Multi-function test cartridges
  • SECS/GEM communication
  • Image capture for failure mode analysis

Nordson DAGE 4600 Automated Bond Tester overview

DAGE4800 Device Automatic Allignment
DAGE4800WaferMap - Paragon Operating Software
DAGE4800 Wafer Chuck

Camera assisted programming & Automation
Ultimate accuracy using on-board cameras with live images during testing
High resolution field of view and alignment cameras, plus fiducial images for automatic alignment
Image capture tool after test for failure analysis, includes compound surface imaging (CSI) that scans through a Z-stack to get every point in focus

 

Multi-Function Cartridges (MFC's)
Multiple versions available (e.g. Hybrid - Shear 250g, Pull 1Kg & Pull 10Kg; Semi - Shear 250g, Shear 5Kg & Pull 100g)
Configurable with cold bump pull (CBP) and rotational shear
Frictionless pull & patented air bearing technology for shear testing
Safety park position, protects the transducers inside the cartridge when not in use

 

Paragon Graphical User Interface Software
Quick and easy to Use
Flexible analysis and reporting
Built in check lists & help
Schematic virtual images displayed

Automation assisted GUI

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Automated Semiconductor Defect Analysis & Process Characterisation, Wire Bond Pull Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Bond Shear Strength Checks, Bump Test, Cold-Pull Testing etc.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Nordson-DAGE Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416